One-line summary
On October 13, 2026, Huawei announced at its 2026 Terminal Innovation Briefing that the Kirin 9050 series has entered mass production, disclosed that cumulative Kirin terminal shipments since the 2023 return exceeded 100 million units, and that the next-generation Kirin 2027 chip is ready with test results meeting expectations.
Event Overview
According to EET-China's report published on October 14, 2026, Huawei made three announcements at its "2026 Terminal Innovation Briefing" on October 13, 2026: the Kirin 9050 series, which debuted with the HUAWEI Mate XT 2 tri-fold and Mate 90 Pro Max, has officially entered mass production; cumulative shipments of Kirin terminals since the Kirin's 2023 return have exceeded 100 million units; and the next-generation Kirin 2027 chip is ready, with all test results meeting expectations.
Key Information
| Item | Detail |
|---|---|
| Date | October 13, 2026 (2026 Terminal Innovation Briefing) |
| Publisher | Huawei |
| Event | Kirin 9050 series mass production; cumulative Kirin terminal shipments over 100 million; Kirin 2027 chip ready |
| Background | Kirin 9050 Pro debuted with HUAWEI Mate XT 2 on September 7, 2026 (Huawei's first new Kirin chip at a flagship launch in six years) |
Background: Kirin 9050 Pro is the first high-performance chip using logic-folding technology. According to Xinhua Net's September 7, 2026 report, it debuted with the HUAWEI Mate XT 2 Ultimate Design, lifting whole-device performance by 42% over the previous generation; Guangming Net reported that Richard Yu, Huawei's Executive Director and Chairman of the Terminal BG, detailed the chip at the launch.