TL;DR
China's Ministry of Industry and Information Technology (MIIT) and the National Development and Reform Commission (NDRC) issued the 15th Five-Year Plan for the electronic information manufacturing industry on September 15, 2026, calling to raise AI chip design capability and chart new routes such as software-hardware co-designed inference chips.
Event overview
CLS (Cailianshe) reported on September 15, 2026 that MIIT and NDRC issued the 15th Five-Year Plan for the development of the electronic information manufacturing industry. The plan calls for raising AI chip design capability and conducting innovation in technologies including tensor-core dataflow organization, mixed precision, dynamic sparse computing and unified memory architecture.
Key facts
- Issuing bodies and date: MIIT and NDRC, issued on September 15, 2026.
- Document: the 15th Five-Year Plan for the development of the electronic information manufacturing industry.
- AI chip R&D directions: innovation in tensor-core dataflow organization, mixed precision, dynamic sparse computing and unified memory architecture.
- Core performance targets: low latency, high throughput and low power consumption.
- Processor roadmaps: raise the comprehensive computing capability of GPGPUs, ASICs and SoCs; chart new routes such as software-hardware co-designed inference chips.
- New products: scenario-based systems engineering to develop heterogeneous intelligent computing systems, cloud training devices, edge inference devices, embedded real-time computing devices, large-model all-in-ones and training-inference integrated machines.
Official sources
- CLS (September 15, 2026): Two ministries: raising AI chip design capability