News

OpenAI Deepens Chip Partnership with Samsung for Next-Generation AI Chips

On Sept 9, 2026 OpenAI's Korea GM said Samsung partnership made most progress on next-gen chip R&D and joint production, extending from HBM4 supply to foundry and packaging.

TL;DR

On September 9, 2026, OpenAI Korea GM Harrison Kim said at a Seoul press conference that OpenAI and Samsung Electronics made the most progress on next-generation AI chip R&D and joint production; cooperation now extends from HBM4 memory supply to foundry and packaging.

Event overview

On September 9, 2026, OpenAI Korea General Manager Harrison Kim told a press conference in Seoul that OpenAI and Samsung Electronics have made the most progress on the R&D and joint production of next-generation chips, with the widest recognition. In June 2026, OpenAI shipped its first custom AI chip co-designed with Broadcom. According to reports cited by Wall Street News, the cooperation extends from Samsung's supply of HBM4 memory to exploring foundry and packaging. By the end of August 2026, ChatGPT Enterprise users among Korean companies and institutions had grown about 28x year over year, making Samsung one of OpenAI's largest enterprise deployments worldwide.

Key facts

ItemDetail
DateSeptember 9, 2026
VenuePress conference in Seoul, South Korea
PartiesOpenAI Korea GM Harrison Kim; Samsung Electronics
EventMost progress on next-gen chip R&D and joint production
ScopeFrom HBM4 memory supply to foundry and packaging
BackgroundJune 2026: first custom AI chip co-designed with Broadcom
KoreaChatGPT Enterprise users up about 28x YoY by end-August 2026

Official sources