TL;DR
TrendForce expects conventional DRAM contract prices to rise 13% to 18% quarter over quarter and NAND flash 10% to 15% in Q3 2026. Apple, Huawei, Xiaomi and Honor have been raising prices on main models in September, as memory costs pass through to consumer electronics.
Data notes
This dataset compiles figures from a Securities Daily report of September 14, 2026 and the data it cites from TrendForce, Counterpoint Research and China's National Bureau of Statistics, covering memory contract-price forecasts, end-market price moves and capacity structure. All figures are traceable public data; time references are stated per row.
Core data
| metric | value | period | source |
|---|---|---|---|
| Conventional DRAM contract price QoQ change (forecast) | +13% to +18% | Q3 2026 | TrendForce |
| NAND flash contract price QoQ change (forecast) | +10% to +15% | Q3 2026 | TrendForce |
| Smartphone memory price QoQ change | more than +80% | Q2 2026 | Counterpoint Research |
| Mobile phone price YoY change | +11.0% | August 2026 | National Bureau of Statistics |
| Share of DRAM wafer input for HBM by top-3 makers | about 22% | end-2026 (forecast) | TrendForce |
| Share of memory bit output from HBM | about 9% | end-2026 (forecast) | TrendForce |
End-market pass-through
A Securities Daily report of September 14, 2026 said Apple, Huawei, Xiaomi and Honor have been raising prices on their main models in September 2026. The report said the move is not a single-company action, driven by rising memory chip prices passing through to consumer electronics.
Sources
- Securities Daily (September 14, 2026, via Hexun): memory chip price hikes and AI compute expansion report
- TrendForce: https://www.trendforce.com/
- Counterpoint Research: https://www.counterpointresearch.com/
- National Bureau of Statistics: https://www.stats.gov.cn/